Android Backstage, a podcast by and for Android developers. Hosted by developers from the Android engineering team, this show covers topics of interest to Android programmers, with in-depth discussions and interviews with engineers on the Android team at Google. Subscribe to Android Developers YouTube → https://goo.gle/AndroidDevs
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Inhalt bereitgestellt von Reliability Matters and Mike Konrad. Alle Podcast-Inhalte, einschließlich Episoden, Grafiken und Podcast-Beschreibungen, werden direkt von Reliability Matters and Mike Konrad oder seinem Podcast-Plattformpartner hochgeladen und bereitgestellt. Wenn Sie glauben, dass jemand Ihr urheberrechtlich geschütztes Werk ohne Ihre Erlaubnis nutzt, können Sie dem hier beschriebenen Verfahren folgen https://de.player.fm/legal.
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Episode 114: The Remarkable Return of the Post-Reflow Cleaning Process
MP3•Episode-Home
Manage episode 355956010 series 2522856
Inhalt bereitgestellt von Reliability Matters and Mike Konrad. Alle Podcast-Inhalte, einschließlich Episoden, Grafiken und Podcast-Beschreibungen, werden direkt von Reliability Matters and Mike Konrad oder seinem Podcast-Plattformpartner hochgeladen und bereitgestellt. Wenn Sie glauben, dass jemand Ihr urheberrechtlich geschütztes Werk ohne Ihre Erlaubnis nutzt, können Sie dem hier beschriebenen Verfahren folgen https://de.player.fm/legal.
On this show, we’ve discussed many aspects of the Electronics assembly process. We talked about reflow, thermal management, printing, soldering materials, additives, and so much more. What do all these topics have in common? When done correctly, they all contribute to the reliability of circuit assemblies.
Today, we’re going to dive into the subject of cleaning circuit assemblies after reflow. For many assemblers, the cleaning process was replaced by the use of no clean flux technology. Time and technology have eroded the concept of allowing all residues to remain on the assembly. Today, residue caused failures are such a concern, that IPC recently and radically changed the way circuit assemblies are considered to be clean.
My guests today are Sal Sparacino and Eric Camden. Sal is Director of Sales at Zestron Americas, located in Manassas Virginia. Zestron is a manufacturer of cleaning chemicals for the electronics industry. Eric is Lead Investigator for Foresite, an analytical laboratory based in Kokomo Indiana. Eric, is the guy you call when things go wrong. Together with my experience as a cleaning equipment manufacturer, we’ll discuss how cleaning contributes to increased reliability, and we’ll review the reasons cleaning has returned as a mainstream assembly process.
Guest Contact Info:
Sal Sparacino
sal.sparacino@zestronusa.com
https://www.zestron.com
Eric Camden
ericc@foresiteinc.com
https://www.foresiteinc.com
…
continue reading
Today, we’re going to dive into the subject of cleaning circuit assemblies after reflow. For many assemblers, the cleaning process was replaced by the use of no clean flux technology. Time and technology have eroded the concept of allowing all residues to remain on the assembly. Today, residue caused failures are such a concern, that IPC recently and radically changed the way circuit assemblies are considered to be clean.
My guests today are Sal Sparacino and Eric Camden. Sal is Director of Sales at Zestron Americas, located in Manassas Virginia. Zestron is a manufacturer of cleaning chemicals for the electronics industry. Eric is Lead Investigator for Foresite, an analytical laboratory based in Kokomo Indiana. Eric, is the guy you call when things go wrong. Together with my experience as a cleaning equipment manufacturer, we’ll discuss how cleaning contributes to increased reliability, and we’ll review the reasons cleaning has returned as a mainstream assembly process.
Guest Contact Info:
Sal Sparacino
sal.sparacino@zestronusa.com
https://www.zestron.com
Eric Camden
ericc@foresiteinc.com
https://www.foresiteinc.com
150 Episoden
MP3•Episode-Home
Manage episode 355956010 series 2522856
Inhalt bereitgestellt von Reliability Matters and Mike Konrad. Alle Podcast-Inhalte, einschließlich Episoden, Grafiken und Podcast-Beschreibungen, werden direkt von Reliability Matters and Mike Konrad oder seinem Podcast-Plattformpartner hochgeladen und bereitgestellt. Wenn Sie glauben, dass jemand Ihr urheberrechtlich geschütztes Werk ohne Ihre Erlaubnis nutzt, können Sie dem hier beschriebenen Verfahren folgen https://de.player.fm/legal.
On this show, we’ve discussed many aspects of the Electronics assembly process. We talked about reflow, thermal management, printing, soldering materials, additives, and so much more. What do all these topics have in common? When done correctly, they all contribute to the reliability of circuit assemblies.
Today, we’re going to dive into the subject of cleaning circuit assemblies after reflow. For many assemblers, the cleaning process was replaced by the use of no clean flux technology. Time and technology have eroded the concept of allowing all residues to remain on the assembly. Today, residue caused failures are such a concern, that IPC recently and radically changed the way circuit assemblies are considered to be clean.
My guests today are Sal Sparacino and Eric Camden. Sal is Director of Sales at Zestron Americas, located in Manassas Virginia. Zestron is a manufacturer of cleaning chemicals for the electronics industry. Eric is Lead Investigator for Foresite, an analytical laboratory based in Kokomo Indiana. Eric, is the guy you call when things go wrong. Together with my experience as a cleaning equipment manufacturer, we’ll discuss how cleaning contributes to increased reliability, and we’ll review the reasons cleaning has returned as a mainstream assembly process.
Guest Contact Info:
Sal Sparacino
sal.sparacino@zestronusa.com
https://www.zestron.com
Eric Camden
ericc@foresiteinc.com
https://www.foresiteinc.com
…
continue reading
Today, we’re going to dive into the subject of cleaning circuit assemblies after reflow. For many assemblers, the cleaning process was replaced by the use of no clean flux technology. Time and technology have eroded the concept of allowing all residues to remain on the assembly. Today, residue caused failures are such a concern, that IPC recently and radically changed the way circuit assemblies are considered to be clean.
My guests today are Sal Sparacino and Eric Camden. Sal is Director of Sales at Zestron Americas, located in Manassas Virginia. Zestron is a manufacturer of cleaning chemicals for the electronics industry. Eric is Lead Investigator for Foresite, an analytical laboratory based in Kokomo Indiana. Eric, is the guy you call when things go wrong. Together with my experience as a cleaning equipment manufacturer, we’ll discuss how cleaning contributes to increased reliability, and we’ll review the reasons cleaning has returned as a mainstream assembly process.
Guest Contact Info:
Sal Sparacino
sal.sparacino@zestronusa.com
https://www.zestron.com
Eric Camden
ericc@foresiteinc.com
https://www.foresiteinc.com
150 Episoden
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